| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame. |
| Memory corruption in Core while processing control functions. |
| Memory corruption when preparing a shared memory notification for a memparcel in Resource Manager. |
| Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests. |
| Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element. |
| Information disclosure in Video while parsing mp2 clip with invalid section length. |
| Memory corruption while processing finish_sign command to pass a rsp buffer. |
| Transient DOS when processing a NULL buffer while parsing WLAN vdev. |
| Memory corruption while copying the result to the transmission queue which is shared between the virtual machine and the host. |
| Transient DOS while processing 11AZ RTT management action frame received through OTA. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. |
| Memory corruption when IPv6 prefix timer object`s lifetime expires which are created while Netmgr daemon gets an IPv6 address. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
| Memory corruption in Audio during playback with speaker protection. |
| Memory corruption in Automotive Multimedia due to improper access control in HAB. |
