| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Memory Corruption in Data Modem while making a MO call or MT VOLTE call. |
| Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points. |
| Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper. |
| Memory corruption while passing untrusted/corrupted pointers from DSP to EVA. |
| Memory corruption when BTFM client sends new messages over Slimbus to ADSP. |
| Memory corruption while processing concurrent IOCTL calls. |
| Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. |
| Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame. |
| Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments. |
| Memory corruption when invalid length is provided from HLOS for FRS/UDS request/response buffers. |
| Memory corruption while processing IOCTL call for getting group info. |
| Memory corruption in MPP performance while accessing DSM watermark using external memory address. |
| Memory Corruption in Data Modem while processing DMA buffer release event about CFR data. |
| Memory corruption when the IOCTL call is interrupted by a signal. |
| Memory corruption while processing finish_sign command to pass a rsp buffer. |
| Memory corruption in Audio when memory map command is executed consecutively in ADSP. |
| Memory corruption when user provides data for FM HCI command control operations. |
| Memory corruption in HLOS while running playready use-case. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |